Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies

[Image: see text] Oxide and nitride thin-films of Ti, Hf, and Si serve numerous applications owing to the diverse range of their material properties. It is therefore imperative to have proper control over these properties during materials processing. Ion-surface interactions during plasma processing...

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Detalles Bibliográficos
Autores principales: Faraz, Tahsin, Knoops, Harm C. M., Verheijen, Marcel A., van Helvoirt, Cristian A. A., Karwal, Saurabh, Sharma, Akhil, Beladiya, Vivek, Szeghalmi, Adriana, Hausmann, Dennis M., Henri, Jon, Creatore, Mariadriana, Kessels, Wilhelmus M. M.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2018
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5909180/
https://www.ncbi.nlm.nih.gov/pubmed/29554799
http://dx.doi.org/10.1021/acsami.8b00183

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5909180/
https://www.ncbi.nlm.nih.gov/pubmed/29554799
http://dx.doi.org/10.1021/acsami.8b00183

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