Cargando…
Mechanical Characterization of Polysilicon MEMS: A Hybrid TMCMC/POD-Kriging Approach
Microscale uncertainties related to the geometry and morphology of polycrystalline silicon films, constituting the movable structures of micro electro-mechanical systems (MEMS), were investigated through a joint numerical/experimental approach. An on-chip testing device was designed and fabricated t...
Autores principales: | Mirzazadeh, Ramin, Eftekhar Azam, Saeed, Mariani, Stefano |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5948683/ https://www.ncbi.nlm.nih.gov/pubmed/29673228 http://dx.doi.org/10.3390/s18041243 |
Ejemplares similares
-
Micromechanical Characterization of Polysilicon Films through On-Chip Tests
por: Mirzazadeh, Ramin, et al.
Publicado: (2016) -
Uncertainty Quantification of Microstructure—Governed Properties of Polysilicon MEMS
por: Mirzazadeh, Ramin, et al.
Publicado: (2017) -
Statistical Investigation of the Mechanical and Geometrical Properties of Polysilicon Films through On-Chip Tests
por: Mirzazadeh, Ramin, et al.
Publicado: (2018) -
MEMS Reliability: On-Chip Testing for the Characterization of the Out-of-Plane Polysilicon Strength
por: Vicentini Ferreira do Valle, Tiago, et al.
Publicado: (2023) -
Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach
por: Mariani, Stefano, et al.
Publicado: (2009)