Silver oxide decomposition mediated direct bonding of silicon-based materials

Silicon-based materials are widely promising electronic components by the combination with metals in power electronics field. However, bonding metal and silicon-based materials generally requires specific surface modification due to their different chemical bonds. Here, we demonstrate a process for...

Descripción completa

Detalles Bibliográficos
Autores principales: Matsuda, Tomoki, Inami, Kota, Motoyama, Keita, Sano, Tomokazu, Hirose, Akio
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6041264/
https://www.ncbi.nlm.nih.gov/pubmed/29993004
http://dx.doi.org/10.1038/s41598-018-28788-x

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6041264/
https://www.ncbi.nlm.nih.gov/pubmed/29993004
http://dx.doi.org/10.1038/s41598-018-28788-x

Ejemplares similares