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Silver oxide decomposition mediated direct bonding of silicon-based materials
Silicon-based materials are widely promising electronic components by the combination with metals in power electronics field. However, bonding metal and silicon-based materials generally requires specific surface modification due to their different chemical bonds. Here, we demonstrate a process for...
Autores principales: | Matsuda, Tomoki, Inami, Kota, Motoyama, Keita, Sano, Tomokazu, Hirose, Akio |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group UK
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6041264/ https://www.ncbi.nlm.nih.gov/pubmed/29993004 http://dx.doi.org/10.1038/s41598-018-28788-x |
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