Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications

Recently, nanosilver pastes have emerged as one of the most promising high temperature bonding materials for high frequency and high power applications, which provide an effective lead-free electronic packaging solution instead of high-lead and gold-based solders. Although nanosilver pastes can be s...

Descripción completa

Detalles Bibliográficos
Autores principales: Liu, Wei, An, Rong, Wang, Chunqing, Zheng, Zhen, Tian, Yanhong, Xu, Ronglin, Wang, Zhongtao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6082269/
https://www.ncbi.nlm.nih.gov/pubmed/30424279
http://dx.doi.org/10.3390/mi9070346

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6082269/
https://www.ncbi.nlm.nih.gov/pubmed/30424279
http://dx.doi.org/10.3390/mi9070346

Ejemplares similares