Measurement and Isolation of Thermal Stress in Silicon-On-Glass MEMS Structures

The mechanical stress in silicon-on-glass MEMS structures and a stress isolation scheme were studied by analysis and experimentation. Double-ended tuning forks (DETFs) were used to measure the stress based on the stress-frequency conversion effect. Considering the coefficients of thermal expansion (...

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Detalles Bibliográficos
Autores principales: Chen, Zhiyong, Guo, Meifeng, Zhang, Rong, Zhou, Bin, Wei, Qi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6111565/
https://www.ncbi.nlm.nih.gov/pubmed/30096854
http://dx.doi.org/10.3390/s18082603

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6111565/
https://www.ncbi.nlm.nih.gov/pubmed/30096854
http://dx.doi.org/10.3390/s18082603

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