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Measurement and Isolation of Thermal Stress in Silicon-On-Glass MEMS Structures
The mechanical stress in silicon-on-glass MEMS structures and a stress isolation scheme were studied by analysis and experimentation. Double-ended tuning forks (DETFs) were used to measure the stress based on the stress-frequency conversion effect. Considering the coefficients of thermal expansion (...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2018
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6111565/ https://www.ncbi.nlm.nih.gov/pubmed/30096854 http://dx.doi.org/10.3390/s18082603 |