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Theoretical predicted high-thermal-conductivity cubic Si(3)N(4) and Ge(3)N(4): promising substrate materials for high-power electronic devices
Ceramic substrates play key roles in power electronic device technology through dissipating heat, wherein both high thermal conductivity and mechanical strength are required. The increased power of new devices has led to the replacement of Al(2)O(3) by high thermal conducting AlN and further β-Si(3)...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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Nature Publishing Group UK
2018
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6158267/ https://www.ncbi.nlm.nih.gov/pubmed/30258201 http://dx.doi.org/10.1038/s41598-018-32739-x |