Degradation kinetics of Ti-Cu compound layer in transient liquid phase bonded graphite/copper joints

The continuous Ti-Cu compound layer produced in brazing of graphite to copper with Ti foil is found to be seriously detrimental to joint properties due to its brittleness. In this work, a transient liquid phase (TLP) bonding method with a diffusion process below melting point is developed to realize...

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Detalles Bibliográficos
Autores principales: Lin, Jincheng, Huang, Mei, Yang, Weiqi, Xing, Lili
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6185917/
https://www.ncbi.nlm.nih.gov/pubmed/30315312
http://dx.doi.org/10.1038/s41598-018-33446-3

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6185917/
https://www.ncbi.nlm.nih.gov/pubmed/30315312
http://dx.doi.org/10.1038/s41598-018-33446-3

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