Fabrication of Through via Holes in Ultra-Thin Fused Silica Wafers for Microwave and Millimeter-Wave Applications

Through via holes in fused silica are a key infrastructure element of microwave and millimeter-wave circuits and 3D integration. In this work, etching through via holes in ultra-thin fused silica wafers using deep reactive-ion etching (DRIE) and laser ablation was developed and analyzed. The experim...

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Detalles Bibliográficos
Autores principales: Li, Xiao, Chan, King Yuk, Ramer, Rodica
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6187369/
https://www.ncbi.nlm.nih.gov/pubmed/30424072
http://dx.doi.org/10.3390/mi9030138

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6187369/
https://www.ncbi.nlm.nih.gov/pubmed/30424072
http://dx.doi.org/10.3390/mi9030138

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