Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions

Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer. For shrinking the chip size of MEMS (micro electro mechanical systems), a smaller size of wafer-l...

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Detalles Bibliográficos
Autores principales: Satoh, Shiro, Fukushi, Hideyuki, Esashi, Masayoshi, Tanaka, Shuji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6187392/
https://www.ncbi.nlm.nih.gov/pubmed/30424107
http://dx.doi.org/10.3390/mi9040174

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6187392/
https://www.ncbi.nlm.nih.gov/pubmed/30424107
http://dx.doi.org/10.3390/mi9040174

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