3D Integrated Circuit Cooling with Microfluidics

Using microfluidic cooling to achieve thermal management of three-dimensional integrated circuits (ICs) is recognized as a promising method of extending Moore law progression in electronic components and systems. Since the U.S. Defense Advanced Research Projects Agency launched Intra/Inter Chip Enha...

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Detalles Bibliográficos
Autores principales: Wang, Shaoxi, Yin, Yue, Hu, Chenxia, Rezai, Pouya
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6187454/
https://www.ncbi.nlm.nih.gov/pubmed/30424220
http://dx.doi.org/10.3390/mi9060287

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6187454/
https://www.ncbi.nlm.nih.gov/pubmed/30424220
http://dx.doi.org/10.3390/mi9060287

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