Technology for 3D System Integration for Flexible Wireless Biomedical Applications

This paper presents a new 3D bottom-up packing technology for integrating a chip, an induction coil, and interconnections for flexible wireless biomedical applications. Parylene was used as a flexible substrate for the bottom-up embedding of the chip, insulation layer, interconnection, and inductors...

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Detalles Bibliográficos
Autores principales: Kuo, Wen-Cheng, Huang, Chih-Wei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6187830/
https://www.ncbi.nlm.nih.gov/pubmed/30424146
http://dx.doi.org/10.3390/mi9050213

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6187830/
https://www.ncbi.nlm.nih.gov/pubmed/30424146
http://dx.doi.org/10.3390/mi9050213

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