Stress Distribution Profile Imaging With Spectral Fabry-Perot Interferometry in Thin Layer Substrates for Surface Micromachining

We have used spectral two-layer interferometry (STLI) imaging for estimation of the stress distribution profiles (SDPs) in thin film substrates, enabling fast and reliable all-optical methodology for the evaluation of pre-stress topography profiles in silicon wafers deposited with thin films. Specif...

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Detalles Bibliográficos
Autores principales: Inzelberg, Adam, Linzon, Yoav
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189764/
https://www.ncbi.nlm.nih.gov/pubmed/30400485
http://dx.doi.org/10.3390/mi8100294

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189764/
https://www.ncbi.nlm.nih.gov/pubmed/30400485
http://dx.doi.org/10.3390/mi8100294

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