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Stress Distribution Profile Imaging With Spectral Fabry-Perot Interferometry in Thin Layer Substrates for Surface Micromachining
We have used spectral two-layer interferometry (STLI) imaging for estimation of the stress distribution profiles (SDPs) in thin film substrates, enabling fast and reliable all-optical methodology for the evaluation of pre-stress topography profiles in silicon wafers deposited with thin films. Specif...
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2017
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189764/ https://www.ncbi.nlm.nih.gov/pubmed/30400485 http://dx.doi.org/10.3390/mi8100294 |