An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices

Solutions for the bonding and sealing of micro-channels in the manufacturing process of microfluidic devices are limited; therefore, further technical developments are required to determine these solutions. In this study, a new bonding method for thermoplastic microfluidic devices was developed by c...

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Detalles Bibliográficos
Autores principales: Gong, Yao, Park, Jang Min, Lim, Jiseok
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189769/
https://www.ncbi.nlm.nih.gov/pubmed/30404382
http://dx.doi.org/10.3390/mi7110211

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189769/
https://www.ncbi.nlm.nih.gov/pubmed/30404382
http://dx.doi.org/10.3390/mi7110211

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