Assembly of a 3D Cellular Computer Using Folded E-Blocks

The assembly of integrated circuits in three dimensions (3D) provides a possible solution to address the ever-increasing demands of modern day electronic devices. It has been suggested that by using the third dimension, devices with high density, defect tolerance, short interconnects and small overa...

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Detalles Bibliográficos
Autores principales: Pandey, Shivendra, Macias, Nicholas J., Ciobanu, Carmen, Yoon, ChangKyu, Teuscher, Christof, Gracias, David H.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189794/
https://www.ncbi.nlm.nih.gov/pubmed/30404253
http://dx.doi.org/10.3390/mi7050078

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189794/
https://www.ncbi.nlm.nih.gov/pubmed/30404253
http://dx.doi.org/10.3390/mi7050078

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