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A New Method of Fixing High-Aspect-Ratio Microstructures by Gel

In the microfabrication processes, it is necessary to examine the quality of the structures to ensure the whole process runs smoothly. However, the examination process of pattern defects is interrupted during the fabrication of high-aspect-ratio microstructures. The inevitable pattern defects arise...

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Autores principales: Chen, Nan, Chen, Xiangyu, Xiong, Penghui, Hou, Shuangyue, Zhang, Xiaobo, Xiong, Ying, Liu, Gang, Tian, Yangchao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189917/
https://www.ncbi.nlm.nih.gov/pubmed/30404288
http://dx.doi.org/10.3390/mi7070115
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author Chen, Nan
Chen, Xiangyu
Xiong, Penghui
Hou, Shuangyue
Zhang, Xiaobo
Xiong, Ying
Liu, Gang
Tian, Yangchao
author_facet Chen, Nan
Chen, Xiangyu
Xiong, Penghui
Hou, Shuangyue
Zhang, Xiaobo
Xiong, Ying
Liu, Gang
Tian, Yangchao
author_sort Chen, Nan
collection PubMed
description In the microfabrication processes, it is necessary to examine the quality of the structures to ensure the whole process runs smoothly. However, the examination process of pattern defects is interrupted during the fabrication of high-aspect-ratio microstructures. The inevitable pattern defects arise from capillary forces which occur during the liquid drying process. In this paper, a new method that enables us to fix the microstructures with gel to restrict deformations before the rinsed liquid drying process has been proposed. It is effective to avoid the capillary forces by preventing the formation of the liquid level. The process parameters, types of gel, gel time and observation time were discussed and the flatness and thickness of the gel layer could be controlled. A series of high-aspect-ratio microstructures were fixed in good condition by gel.
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spelling pubmed-61899172018-11-01 A New Method of Fixing High-Aspect-Ratio Microstructures by Gel Chen, Nan Chen, Xiangyu Xiong, Penghui Hou, Shuangyue Zhang, Xiaobo Xiong, Ying Liu, Gang Tian, Yangchao Micromachines (Basel) Article In the microfabrication processes, it is necessary to examine the quality of the structures to ensure the whole process runs smoothly. However, the examination process of pattern defects is interrupted during the fabrication of high-aspect-ratio microstructures. The inevitable pattern defects arise from capillary forces which occur during the liquid drying process. In this paper, a new method that enables us to fix the microstructures with gel to restrict deformations before the rinsed liquid drying process has been proposed. It is effective to avoid the capillary forces by preventing the formation of the liquid level. The process parameters, types of gel, gel time and observation time were discussed and the flatness and thickness of the gel layer could be controlled. A series of high-aspect-ratio microstructures were fixed in good condition by gel. MDPI 2016-07-09 /pmc/articles/PMC6189917/ /pubmed/30404288 http://dx.doi.org/10.3390/mi7070115 Text en © 2016 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Chen, Nan
Chen, Xiangyu
Xiong, Penghui
Hou, Shuangyue
Zhang, Xiaobo
Xiong, Ying
Liu, Gang
Tian, Yangchao
A New Method of Fixing High-Aspect-Ratio Microstructures by Gel
title A New Method of Fixing High-Aspect-Ratio Microstructures by Gel
title_full A New Method of Fixing High-Aspect-Ratio Microstructures by Gel
title_fullStr A New Method of Fixing High-Aspect-Ratio Microstructures by Gel
title_full_unstemmed A New Method of Fixing High-Aspect-Ratio Microstructures by Gel
title_short A New Method of Fixing High-Aspect-Ratio Microstructures by Gel
title_sort new method of fixing high-aspect-ratio microstructures by gel
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189917/
https://www.ncbi.nlm.nih.gov/pubmed/30404288
http://dx.doi.org/10.3390/mi7070115
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