Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries

This publication provides an overview and discusses some challenges of surface tension directed fluidic self-assembly of semiconductor chips which are transported in a liquid medium. The discussion is limited to surface tension directed self-assembly where the capture, alignment, and electrical conn...

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Detalles Bibliográficos
Autores principales: Biswas, Shantonu, Mozafari, Mahsa, Stauden, Thomas, Jacobs, Heiko O.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190092/
https://www.ncbi.nlm.nih.gov/pubmed/30407427
http://dx.doi.org/10.3390/mi7040054

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190092/
https://www.ncbi.nlm.nih.gov/pubmed/30407427
http://dx.doi.org/10.3390/mi7040054

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