Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process

This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass...

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Detalles Bibliográficos
Autores principales: Toan, Nguyen Van, Hahng, Shim, Song, Yunheub, Ono, Takahito
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190351/
https://www.ncbi.nlm.nih.gov/pubmed/30404250
http://dx.doi.org/10.3390/mi7050076

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190351/
https://www.ncbi.nlm.nih.gov/pubmed/30404250
http://dx.doi.org/10.3390/mi7050076

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