Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

To increase the yield of the wafer-level Cu-Cu thermo-compression bonding method, certain surface pre-treatment methods for Cu are studied which can be exposed to the atmosphere before bonding. To inhibit re-oxidation under atmospheric conditions, the reduced pure Cu surface is treated by H(2)/Ar pl...

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Detalles Bibliográficos
Autores principales: Tanaka, Koki, Wang, Wei-Shan, Baum, Mario, Froemel, Joerg, Hirano, Hideki, Tanaka, Shuji, Wiemer, Maik, Otto, Thomas
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190367/
https://www.ncbi.nlm.nih.gov/pubmed/30404406
http://dx.doi.org/10.3390/mi7120234

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190367/
https://www.ncbi.nlm.nih.gov/pubmed/30404406
http://dx.doi.org/10.3390/mi7120234

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