High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

High aspect ratio three-dimensional micro- and nanopatterns have important applications in diverse fields. However, fabricating these structures by a nanoimprinting method invites problems like collapse, dislocation, and defects. Finite-element analysis (FEA) is a good approach to help understand th...

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Detalles Bibliográficos
Autores principales: Sun, Hongwen, Yin, Minqi, Wang, Haibin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190371/
https://www.ncbi.nlm.nih.gov/pubmed/30400434
http://dx.doi.org/10.3390/mi8080243

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190371/
https://www.ncbi.nlm.nih.gov/pubmed/30400434
http://dx.doi.org/10.3390/mi8080243

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