Cargando…
High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis
High aspect ratio three-dimensional micro- and nanopatterns have important applications in diverse fields. However, fabricating these structures by a nanoimprinting method invites problems like collapse, dislocation, and defects. Finite-element analysis (FEA) is a good approach to help understand th...
Autores principales: | Sun, Hongwen, Yin, Minqi, Wang, Haibin |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2017
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190371/ https://www.ncbi.nlm.nih.gov/pubmed/30400434 http://dx.doi.org/10.3390/mi8080243 |
Ejemplares similares
-
Resist Filling Study for UV Nanoimprint Lithography Using Stamps with Various Micro/Nano Ratios
por: Yin, Minqi, et al.
Publicado: (2018) -
High-aspect-ratio nanoimprint process chains
por: Cadarso, Víctor J., et al.
Publicado: (2017) -
A modified squeeze equation for predicting the filling ratio of nanoimprint lithography
por: Ryu, JiHyeong, et al.
Publicado: (2017) -
Effective surface oxidation of polymer replica molds for nanoimprint lithography
por: Ryu, Ilhwan, et al.
Publicado: (2012) -
Evaluation of cavity size, kind, and filling technique of composite shrinkage by finite element
por: Jafari, Toloo, et al.
Publicado: (2018)