A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices

Smart devices have been fabricated based on design concept of multiple layer structures which require through silicon vias to transfer electric signals between stacked layers. Because even a single defect leads to fail of the packaged devices, the dimensions of the through silicon vias are needed to...

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Detalles Bibliográficos
Autores principales: Ahn, Heulbi, Bae, Jaeseok, Park, Jungjae, Jin, Jonghan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6203746/
https://www.ncbi.nlm.nih.gov/pubmed/30367137
http://dx.doi.org/10.1038/s41598-018-33728-w

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6203746/
https://www.ncbi.nlm.nih.gov/pubmed/30367137
http://dx.doi.org/10.1038/s41598-018-33728-w

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