Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds

With the aim of overcoming the limitations of traditional soldering ceramic methods for power device packaging, a simple but ultrafast bonding technology is reported. The effect and mechanism of ultrasonic action on the interfacial bonding and microstructure is investigated and thoroughly discussed....

Descripción completa

Detalles Bibliográficos
Autores principales: Wu, Bingzhi, Leng, Xuesong, Xiu, Ziyang, Yan, Jiuchun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6237854/
https://www.ncbi.nlm.nih.gov/pubmed/30442896
http://dx.doi.org/10.1038/s41598-018-34635-w

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6237854/
https://www.ncbi.nlm.nih.gov/pubmed/30442896
http://dx.doi.org/10.1038/s41598-018-34635-w

Ejemplares similares