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Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds
With the aim of overcoming the limitations of traditional soldering ceramic methods for power device packaging, a simple but ultrafast bonding technology is reported. The effect and mechanism of ultrasonic action on the interfacial bonding and microstructure is investigated and thoroughly discussed....
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2018
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6237854/ https://www.ncbi.nlm.nih.gov/pubmed/30442896 http://dx.doi.org/10.1038/s41598-018-34635-w |