Aluminum Patterned Electroplating from AlCl(3)–[EMIm]Cl Ionic Liquid towards Microsystems Application †

Electroplating process is being used to deposit a relatively thick film of metallic materials for various microsystems applications, such as for the wafer-level bonding sealing frame and as a thermal actuator. Recently, the Al electroplating process from ionic liquid has been an attractive depositio...

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Detalles Bibliográficos
Autores principales: Al Farisi, Muhammad Salman, Hertel, Silvia, Wiemer, Maik, Otto, Thomas
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6266407/
https://www.ncbi.nlm.nih.gov/pubmed/30424571
http://dx.doi.org/10.3390/mi9110589

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6266407/
https://www.ncbi.nlm.nih.gov/pubmed/30424571
http://dx.doi.org/10.3390/mi9110589

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