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Aluminum Patterned Electroplating from AlCl(3)–[EMIm]Cl Ionic Liquid towards Microsystems Application †
Electroplating process is being used to deposit a relatively thick film of metallic materials for various microsystems applications, such as for the wafer-level bonding sealing frame and as a thermal actuator. Recently, the Al electroplating process from ionic liquid has been an attractive depositio...
Autores principales: | Al Farisi, Muhammad Salman, Hertel, Silvia, Wiemer, Maik, Otto, Thomas |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6266407/ https://www.ncbi.nlm.nih.gov/pubmed/30424571 http://dx.doi.org/10.3390/mi9110589 |
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