Fabrication and Characteristics of SnAgCu Alloy Nanowires for Electrical Connection Application

As electronic products become more functional, the devices are required to provide better performances and meet ever smaller form factor requirements. To achieve a higher I/O density within the smallest form factor package, applying nanotechniques to electronic packaging can be regarded as a possibl...

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Detalles Bibliográficos
Autores principales: Chen, Jung-Hsuan, Lo, Shen-Chuan, Hsu, Shu-Chi, Hsu, Chun-Yao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6316273/
https://www.ncbi.nlm.nih.gov/pubmed/30563062
http://dx.doi.org/10.3390/mi9120644

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6316273/
https://www.ncbi.nlm.nih.gov/pubmed/30563062
http://dx.doi.org/10.3390/mi9120644

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