Ag(3)Sn Compounds Coarsening Behaviors in Micro-Joints

As solder joints are being scaled down, intermetallic compounds (IMCs) are playing an increasingly critical role in the reliability of solder joints, and thereby an in-depth understanding of IMCs microstructure evolutions in micro-joints is of great significance. This study focused on coarsening beh...

Descripción completa

Detalles Bibliográficos
Autores principales: Tian, Ye, Ren, Ning, Zhao, Zhihua, Wu, Fengshun, Sitaraman, Suresh K.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6316964/
https://www.ncbi.nlm.nih.gov/pubmed/30544730
http://dx.doi.org/10.3390/ma11122509

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6316964/
https://www.ncbi.nlm.nih.gov/pubmed/30544730
http://dx.doi.org/10.3390/ma11122509

Ejemplares similares