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Ag(3)Sn Compounds Coarsening Behaviors in Micro-Joints
As solder joints are being scaled down, intermetallic compounds (IMCs) are playing an increasingly critical role in the reliability of solder joints, and thereby an in-depth understanding of IMCs microstructure evolutions in micro-joints is of great significance. This study focused on coarsening beh...
Autores principales: | Tian, Ye, Ren, Ning, Zhao, Zhihua, Wu, Fengshun, Sitaraman, Suresh K. |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6316964/ https://www.ncbi.nlm.nih.gov/pubmed/30544730 http://dx.doi.org/10.3390/ma11122509 |
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