Cargando…
Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors
In this work, efforts were made to prepare a thermostable die-attach structure which includes stable sintered microporous Ag and multi-layer surface metallization. Silicon carbide particles (SiC(p)) were added into the Ag sinter joining paste to improve the high-temperature reliability of the sinter...
| Autores principales: | , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2018
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6317002/ https://www.ncbi.nlm.nih.gov/pubmed/30545143 http://dx.doi.org/10.3390/ma11122531 |