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Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface

Organic-inorganic material hybridization at the solid-state level is indispensable for the integration of IoT applications, but still remains a challenging issue. Existing bonding strategies in the field of electronic packaging tend to employ vacuum or ultrahigh temperature; however, these can cause...

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Detalles Bibliográficos
Autores principales: Yang, Tilo H., Kao, C. Robert, Shigetou, Akitsu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6345999/
https://www.ncbi.nlm.nih.gov/pubmed/30679603
http://dx.doi.org/10.1038/s41598-018-37052-1