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Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface
Organic-inorganic material hybridization at the solid-state level is indispensable for the integration of IoT applications, but still remains a challenging issue. Existing bonding strategies in the field of electronic packaging tend to employ vacuum or ultrahigh temperature; however, these can cause...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
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Nature Publishing Group UK
2019
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Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6345999/ https://www.ncbi.nlm.nih.gov/pubmed/30679603 http://dx.doi.org/10.1038/s41598-018-37052-1 |