Cargando…
Growth Characterization of Intermetallic Compound at the Ti/Al Solid State Interface
Ti-Al diffusion couples, prepared by resistance spot welding, were annealed up to 112 h at 823, 848, and 873 K in ambient atmosphere. The interfacial microstructure was observed and analyzed using SEM and TEM. The growth characterization of intermetallic compound formed at the Ti/Al solid state inte...
| Autores principales: | , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2019
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6384985/ https://www.ncbi.nlm.nih.gov/pubmed/30720709 http://dx.doi.org/10.3390/ma12030472 |