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Growth Characterization of Intermetallic Compound at the Ti/Al Solid State Interface

Ti-Al diffusion couples, prepared by resistance spot welding, were annealed up to 112 h at 823, 848, and 873 K in ambient atmosphere. The interfacial microstructure was observed and analyzed using SEM and TEM. The growth characterization of intermetallic compound formed at the Ti/Al solid state inte...

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Detalles Bibliográficos
Autores principales:	Zhao, Yangyang, Li, Jiuyong, Qiu, Ranfeng, Shi, Hongxin
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2019
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6384985/ https://www.ncbi.nlm.nih.gov/pubmed/30720709 http://dx.doi.org/10.3390/ma12030472

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