Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires

Electronic devices are increasingly dense, underscoring the need for effective thermal management. A polyimide (PI) matrix nanocomposite film combining boron nitride (BN)-coated copper nanoparticles (CuNPs@BN) and nanowires (CuNWs@BN) was fabricated by a flexible and fast technique for enhanced ther...

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Detalles Bibliográficos
Autores principales: Zhou, Yongcun, Yu, Shihu, Niu, Huan, Liu, Feng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Communication
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6401696/
https://www.ncbi.nlm.nih.gov/pubmed/30961337
http://dx.doi.org/10.3390/polym10121412

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6401696/
https://www.ncbi.nlm.nih.gov/pubmed/30961337
http://dx.doi.org/10.3390/polym10121412

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