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Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires

Electronic devices are increasingly dense, underscoring the need for effective thermal management. A polyimide (PI) matrix nanocomposite film combining boron nitride (BN)-coated copper nanoparticles (CuNPs@BN) and nanowires (CuNWs@BN) was fabricated by a flexible and fast technique for enhanced ther...

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Detalles Bibliográficos
Autores principales: Zhou, Yongcun, Yu, Shihu, Niu, Huan, Liu, Feng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6401696/
https://www.ncbi.nlm.nih.gov/pubmed/30961337
http://dx.doi.org/10.3390/polym10121412
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author Zhou, Yongcun
Yu, Shihu
Niu, Huan
Liu, Feng
author_facet Zhou, Yongcun
Yu, Shihu
Niu, Huan
Liu, Feng
author_sort Zhou, Yongcun
collection PubMed
description Electronic devices are increasingly dense, underscoring the need for effective thermal management. A polyimide (PI) matrix nanocomposite film combining boron nitride (BN)-coated copper nanoparticles (CuNPs@BN) and nanowires (CuNWs@BN) was fabricated by a flexible and fast technique for enhanced thermal conductivity and the dielectric properties of nanocomposite films. The thermal conductivity of (CuNPs-CuNWs)@BN/PI composite comprising 10 wt % filler loading rose to 4.32 W/mK, indicating a nearly 24.1-fold increase relative to the value obtained for pure PI matrix. The relative permittivity and dielectric loss approximated 4.92 and 0.026 at 1 MHz, respectively. The results indicated that the surface modification of CuNPs and CuNWs by introducing a ceramic insulating layer BN effectively promoted the formation of thermal conductive networks of nanofillers in the PI matrix. This study enabled the identification of appropriate modifier fillers for polymer matrix nanocomposites to improve electronic applications.
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spelling pubmed-64016962019-04-02 Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires Zhou, Yongcun Yu, Shihu Niu, Huan Liu, Feng Polymers (Basel) Communication Electronic devices are increasingly dense, underscoring the need for effective thermal management. A polyimide (PI) matrix nanocomposite film combining boron nitride (BN)-coated copper nanoparticles (CuNPs@BN) and nanowires (CuNWs@BN) was fabricated by a flexible and fast technique for enhanced thermal conductivity and the dielectric properties of nanocomposite films. The thermal conductivity of (CuNPs-CuNWs)@BN/PI composite comprising 10 wt % filler loading rose to 4.32 W/mK, indicating a nearly 24.1-fold increase relative to the value obtained for pure PI matrix. The relative permittivity and dielectric loss approximated 4.92 and 0.026 at 1 MHz, respectively. The results indicated that the surface modification of CuNPs and CuNWs by introducing a ceramic insulating layer BN effectively promoted the formation of thermal conductive networks of nanofillers in the PI matrix. This study enabled the identification of appropriate modifier fillers for polymer matrix nanocomposites to improve electronic applications. MDPI 2018-12-19 /pmc/articles/PMC6401696/ /pubmed/30961337 http://dx.doi.org/10.3390/polym10121412 Text en © 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Communication
Zhou, Yongcun
Yu, Shihu
Niu, Huan
Liu, Feng
Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires
title Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires
title_full Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires
title_fullStr Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires
title_full_unstemmed Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires
title_short Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires
title_sort synergistic improvement in thermal conductivity of polyimide nanocomposite films using boron nitride coated copper nanoparticles and nanowires
topic Communication
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6401696/
https://www.ncbi.nlm.nih.gov/pubmed/30961337
http://dx.doi.org/10.3390/polym10121412
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