Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser

High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decreas...

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Detalles Bibliográficos
Autores principales: Zhao, Wanqin, Wang, Lingzhi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6401753/
https://www.ncbi.nlm.nih.gov/pubmed/30961315
http://dx.doi.org/10.3390/polym10121390

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6401753/
https://www.ncbi.nlm.nih.gov/pubmed/30961315
http://dx.doi.org/10.3390/polym10121390

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