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Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser
High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decreas...
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2018
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6401753/ https://www.ncbi.nlm.nih.gov/pubmed/30961315 http://dx.doi.org/10.3390/polym10121390 |