Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfac...

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Detalles Bibliográficos
Autores principales: Shen, Yu-An, Lin, Chun-Ming, Li, Jiahui, He, Siliang, Nishikawa, Hiroshi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6403290/
https://www.ncbi.nlm.nih.gov/pubmed/30842519
http://dx.doi.org/10.1038/s41598-019-40268-4

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6403290/
https://www.ncbi.nlm.nih.gov/pubmed/30842519
http://dx.doi.org/10.1038/s41598-019-40268-4

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