Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfac...

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Autores principales: Shen, Yu-An, Lin, Chun-Ming, Li, Jiahui, He, Siliang, Nishikawa, Hiroshi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6403290/
https://www.ncbi.nlm.nih.gov/pubmed/30842519
http://dx.doi.org/10.1038/s41598-019-40268-4
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author Shen, Yu-An
Lin, Chun-Ming
Li, Jiahui
He, Siliang
Nishikawa, Hiroshi
author_facet Shen, Yu-An
Lin, Chun-Ming
Li, Jiahui
He, Siliang
Nishikawa, Hiroshi
author_sort Shen, Yu-An
collection PubMed
description High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.0Ag-0.5Cu solder and FeCoNiCrCu(0.5) HEA substrate was investigated. (Cu(0.76), Ni(0.24))(6)Sn(5) intermetallic compound was formed the substrate at the interface between the solder and the FeCoNiCrCu(0.5) HEA substrate. The average Sn grain size on the HEA substrate was 246 μm, which was considerably larger than that on a pure Cu substrate. The effect of the substrate on Sn grain size is due to the free energy required for the heterogeneous nucleation of Sn on the FeCoNiCrCu(0.5) substrate.
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spelling pubmed-64032902019-03-08 Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder Shen, Yu-An Lin, Chun-Ming Li, Jiahui He, Siliang Nishikawa, Hiroshi Sci Rep Article High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.0Ag-0.5Cu solder and FeCoNiCrCu(0.5) HEA substrate was investigated. (Cu(0.76), Ni(0.24))(6)Sn(5) intermetallic compound was formed the substrate at the interface between the solder and the FeCoNiCrCu(0.5) HEA substrate. The average Sn grain size on the HEA substrate was 246 μm, which was considerably larger than that on a pure Cu substrate. The effect of the substrate on Sn grain size is due to the free energy required for the heterogeneous nucleation of Sn on the FeCoNiCrCu(0.5) substrate. Nature Publishing Group UK 2019-03-06 /pmc/articles/PMC6403290/ /pubmed/30842519 http://dx.doi.org/10.1038/s41598-019-40268-4 Text en © The Author(s) 2019 Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.
spellingShingle Article
Shen, Yu-An
Lin, Chun-Ming
Li, Jiahui
He, Siliang
Nishikawa, Hiroshi
Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
title Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
title_full Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
title_fullStr Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
title_full_unstemmed Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
title_short Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
title_sort effect of feconicrcu(0.5) high-entropy-alloy substrate on sn grain size in sn-3.0ag-0.5cu solder
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6403290/
https://www.ncbi.nlm.nih.gov/pubmed/30842519
http://dx.doi.org/10.1038/s41598-019-40268-4
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