Heat Dissipation in Epoxy/Amine-Based Gradient Composites with Alumina Particles: A Critical Evaluation of Thermal Conductivity Measurements

For the design of the next generation of microelectronic packages, thermal management is one of the key aspects and must be met by the development of polymers with enhanced thermal conductivity. While all polymer classes show a very low thermal conductivity, this shortcoming can be compensated for b...

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Detalles Bibliográficos
Autores principales: Morak, Matthias, Marx, Philipp, Gschwandl, Mario, Fuchs, Peter Filipp, Pfost, Martin, Wiesbrock, Frank
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6403572/
https://www.ncbi.nlm.nih.gov/pubmed/30961056
http://dx.doi.org/10.3390/polym10101131

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6403572/
https://www.ncbi.nlm.nih.gov/pubmed/30961056
http://dx.doi.org/10.3390/polym10101131

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