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Heat Dissipation in Epoxy/Amine-Based Gradient Composites with Alumina Particles: A Critical Evaluation of Thermal Conductivity Measurements
For the design of the next generation of microelectronic packages, thermal management is one of the key aspects and must be met by the development of polymers with enhanced thermal conductivity. While all polymer classes show a very low thermal conductivity, this shortcoming can be compensated for b...
Autores principales: | Morak, Matthias, Marx, Philipp, Gschwandl, Mario, Fuchs, Peter Filipp, Pfost, Martin, Wiesbrock, Frank |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6403572/ https://www.ncbi.nlm.nih.gov/pubmed/30961056 http://dx.doi.org/10.3390/polym10101131 |
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