Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module

Optimization for heat dissipation plays a significant role in energy saving and high-efficiency utilizing of integrated electronics. In this paper, we present a study of micro structuring on polymer-based flexible substrate coupled with aluminum-alloy heat sink. The heat dissipation performance was...

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Detalles Bibliográficos
Autores principales: Lu, Libin, Zhang, Zhen, Guan, Yingchun, Zheng, Hongyu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6403799/
https://www.ncbi.nlm.nih.gov/pubmed/30960811
http://dx.doi.org/10.3390/polym10080886

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6403799/
https://www.ncbi.nlm.nih.gov/pubmed/30960811
http://dx.doi.org/10.3390/polym10080886

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