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Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module

Optimization for heat dissipation plays a significant role in energy saving and high-efficiency utilizing of integrated electronics. In this paper, we present a study of micro structuring on polymer-based flexible substrate coupled with aluminum-alloy heat sink. The heat dissipation performance was...

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Detalles Bibliográficos
Autores principales:	Lu, Libin, Zhang, Zhen, Guan, Yingchun, Zheng, Hongyu
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2018
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6403799/ https://www.ncbi.nlm.nih.gov/pubmed/30960811 http://dx.doi.org/10.3390/polym10080886

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