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Electrical Properties of Ultrathin Platinum Films by Plasma-Enhanced Atomic Layer Deposition
[Image: see text] The ability to deposit thin and conformal films has become of great importance because of downscaling of devices. However, because of nucleation difficulty, depositing an electrically stable and thin conformal platinum film on an oxide nucleation layer has proven challenging. By us...
Autores principales: | , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
American
Chemical Society
2019
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Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6407042/ https://www.ncbi.nlm.nih.gov/pubmed/30707831 http://dx.doi.org/10.1021/acsami.8b21054 |
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author | Kim, Hyo Jin K. Kaplan, Kirsten E. Schindler, Peter Xu, Shicheng Winterkorn, Martin M. Heinz, David B. English, Timothy S. Provine, J. Prinz, Fritz B. Kenny, Thomas W. |
author_facet | Kim, Hyo Jin K. Kaplan, Kirsten E. Schindler, Peter Xu, Shicheng Winterkorn, Martin M. Heinz, David B. English, Timothy S. Provine, J. Prinz, Fritz B. Kenny, Thomas W. |
author_sort | Kim, Hyo Jin K. |
collection | PubMed |
description | [Image: see text] The ability to deposit thin and conformal films has become of great importance because of downscaling of devices. However, because of nucleation difficulty, depositing an electrically stable and thin conformal platinum film on an oxide nucleation layer has proven challenging. By using plasma-enhanced atomic layer deposition (PEALD) and TiO(2) as a nucleation layer, we achieved electrically continuous PEALD platinum films down to a thickness of 3.7 nm. Results show that for films as thin as 5.7 nm, the Mayadas–Shatzkes (MS) model for electrical conductivity and the Tellier–Tosser model for temperature coefficient of resistance hold. Although the experimental values start to deviate from the MS model below 5.7 nm because of incomplete Pt coverage, the films still show root mean square electrical stability better than 50 ppm over time, indicating that these films are not only electrically continuous but also sufficiently reliable for use in many practical applications. |
format | Online Article Text |
id | pubmed-6407042 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2019 |
publisher | American
Chemical Society |
record_format | MEDLINE/PubMed |
spelling | pubmed-64070422019-03-11 Electrical Properties of Ultrathin Platinum Films by Plasma-Enhanced Atomic Layer Deposition Kim, Hyo Jin K. Kaplan, Kirsten E. Schindler, Peter Xu, Shicheng Winterkorn, Martin M. Heinz, David B. English, Timothy S. Provine, J. Prinz, Fritz B. Kenny, Thomas W. ACS Appl Mater Interfaces [Image: see text] The ability to deposit thin and conformal films has become of great importance because of downscaling of devices. However, because of nucleation difficulty, depositing an electrically stable and thin conformal platinum film on an oxide nucleation layer has proven challenging. By using plasma-enhanced atomic layer deposition (PEALD) and TiO(2) as a nucleation layer, we achieved electrically continuous PEALD platinum films down to a thickness of 3.7 nm. Results show that for films as thin as 5.7 nm, the Mayadas–Shatzkes (MS) model for electrical conductivity and the Tellier–Tosser model for temperature coefficient of resistance hold. Although the experimental values start to deviate from the MS model below 5.7 nm because of incomplete Pt coverage, the films still show root mean square electrical stability better than 50 ppm over time, indicating that these films are not only electrically continuous but also sufficiently reliable for use in many practical applications. American Chemical Society 2019-02-01 2019-03-06 /pmc/articles/PMC6407042/ /pubmed/30707831 http://dx.doi.org/10.1021/acsami.8b21054 Text en Copyright © 2019 American Chemical Society This is an open access article published under a Creative Commons Attribution (CC-BY) License (http://pubs.acs.org/page/policy/authorchoice_ccby_termsofuse.html) , which permits unrestricted use, distribution and reproduction in any medium, provided the author and source are cited. |
spellingShingle | Kim, Hyo Jin K. Kaplan, Kirsten E. Schindler, Peter Xu, Shicheng Winterkorn, Martin M. Heinz, David B. English, Timothy S. Provine, J. Prinz, Fritz B. Kenny, Thomas W. Electrical Properties of Ultrathin Platinum Films by Plasma-Enhanced Atomic Layer Deposition |
title | Electrical
Properties of Ultrathin Platinum Films
by Plasma-Enhanced Atomic Layer Deposition |
title_full | Electrical
Properties of Ultrathin Platinum Films
by Plasma-Enhanced Atomic Layer Deposition |
title_fullStr | Electrical
Properties of Ultrathin Platinum Films
by Plasma-Enhanced Atomic Layer Deposition |
title_full_unstemmed | Electrical
Properties of Ultrathin Platinum Films
by Plasma-Enhanced Atomic Layer Deposition |
title_short | Electrical
Properties of Ultrathin Platinum Films
by Plasma-Enhanced Atomic Layer Deposition |
title_sort | electrical
properties of ultrathin platinum films
by plasma-enhanced atomic layer deposition |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6407042/ https://www.ncbi.nlm.nih.gov/pubmed/30707831 http://dx.doi.org/10.1021/acsami.8b21054 |
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