Residual Stress in Lithium Niobate Film Layer of LNOI/Si Hybrid Wafer Fabricated Using Low-Temperature Bonding Method

This paper focuses on the residual stress in a lithium niobate (LN) film layer of a LN-on-insulator (LNOI)/Si hybrid wafer. This stress originates from a large mismatch between the thermal expansion coefficients of the layers. A modified surface-activated bonding method achieved fabrication of a thi...

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Detalles Bibliográficos
Autores principales: Takigawa, Ryo, Tomimatsu, Toru, Higurashi, Eiji, Asano, Tanemasa
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6412624/
https://www.ncbi.nlm.nih.gov/pubmed/30781672
http://dx.doi.org/10.3390/mi10020136

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6412624/
https://www.ncbi.nlm.nih.gov/pubmed/30781672
http://dx.doi.org/10.3390/mi10020136

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