Effects of High-Temperature Storage on the Elasticity Modulus of an Epoxy Molding Compound

Changes in the elasticity modulus of an epoxy molding compound (EMC), an electronic packaging polymer, under high-temperature air storage conditions, are discussed in this study. The elasticity modulus of EMC had two different compositions (different filling contents) under different temperatures (1...

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Detalles Bibliográficos
Autores principales: Li, Ruifeng, Yang, Daoguo, Zhang, Ping, Niu, Fanfan, Cai, Miao, Zhang, Guoqi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6416563/
https://www.ncbi.nlm.nih.gov/pubmed/30823605
http://dx.doi.org/10.3390/ma12040684

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6416563/
https://www.ncbi.nlm.nih.gov/pubmed/30823605
http://dx.doi.org/10.3390/ma12040684

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