A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders

Low-temperature lead (Pb)-free solders are demanding in the electronic packaging industry, because it would open the door for various economic choices of polymeric materials as substrates and also revives the lower cost processes. Here, we proposed a tin–bismuth–indium–gallium (Sn-52.5Bi-2.68In-1Ga,...

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Detalles Bibliográficos
Autores principales: Yang, Chih-han, Zhou, Shiqi, Lin, Shih-kang, Nishikawa, Hiroshi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6416625/
https://www.ncbi.nlm.nih.gov/pubmed/30791585
http://dx.doi.org/10.3390/ma12040631

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6416625/
https://www.ncbi.nlm.nih.gov/pubmed/30791585
http://dx.doi.org/10.3390/ma12040631

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